Drafting meeting for the group standard of AMB aluminum nitride ceramic copper-clad substrate for insulated gate bipolar transistor (IGBT) modules
Release time:
2020-08-26
The IGBT module packaging aluminum nitride ceramic substrate technology standard seminar was successfully held at the Wuxi Buckingham Grand Hotel on June 15, 2018. The conference was hosted by the China IGBT Technology Innovation and Industry Alliance and Wuxi Tianyang Electronics Co., Ltd. More than 20 people from the National Power Electronics Standardization Committee, the Ministry of Industry and Information Technology Standardization Research Institute, CRRC Times Electric Co., Ltd., CRRC Yongji Electric Semiconductor Division, Global Energy Interconnection Research Institute Power Semiconductor Institute, Jiangsu Hongwei Technology Co., Ltd., Shanghai Shenhe Thermal Magnetic Electronics Co., Ltd., Zhejiang Dehui Electronic Ceramics Co., Ltd., Xi'an Weiguang Technology Co., Ltd., and Jiangsu Zhongke Junxin Technology Co., Ltd. attended the meeting.
On June 15, 2018, the technical standard seminar on aluminum nitride ceramic substrates for IGBT module packaging was successfully held at the Wuxi Buckingham Palace Hotel. The conference was hosted by the China IGBT Technology Innovation and Industry Alliance and Wuxi Tianyang Electronics Co., Ltd. More than 20 people from the National Power Electronics Standardization Committee, the Ministry of Industry and Information Technology Standardization Research Institute, CRRC Times Electric Co., Ltd., CRRC Yongji Electric Motor Semiconductor Division, Global Energy Interconnection Research Institute Power Semiconductor Institute, Jiangsu Hongwei Technology Co., Ltd., Shanghai Shenhe Thermal Magnetic Electronics Co., Ltd., Zhejiang Dehui Electronic Ceramics Co., Ltd., Xi'an Weiguang Technology Co., Ltd., and Jiangsu Zhongke Junxin Technology Co., Ltd. attended the meeting.
At the beginning of the meeting, Xiao Xiangfeng, secretary-general of the China IGBT Technology Innovation and Industry Alliance, and Yu Xiaochu, general manager of Wuxi Tianyang Electronics Co., Ltd., delivered speeches. Following this, the meeting discussed the technical standards for aluminum nitride ceramic substrates used in IGBT module packaging, and a draft of the technical standards for aluminum nitride ceramic substrates used in IGBT module packaging was initially formed. The successful convening of this meeting will help promote the healthy and sustainable development of the power semiconductor ceramic substrate industry.
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