The 4th International Academic Forum of China IGBT Technology Innovation and Industry Alliance-Tianyang Electronics

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The 4th International Academic Forum of China IGBT Technology Innovation and Industry Alliance

Release time:

2020-08-26

On November 6, 2018, the company participated in the "Fourth International Academic Forum of China IGBT Technology Innovation and Industry Alliance" in Zhuzhou and set up an exhibition booth. Aluminum nitride ceramic copper-clad laminates and silicon nitride ceramic copper-clad laminates, as well as press-fit round and square IGBT ceramic packages were exhibited. The picture below shows the Hunan Provincial Governor visiting the company's booth.

On November 6, 2018, the company participated in the "Fourth International Academic Forum of China IGBT Technology Innovation and Industry Alliance" in Zhuzhou and set up an exhibition booth. Aluminum nitride ceramic copper-clad laminates and silicon nitride ceramic copper-clad laminates, as well as press-fit round and square IGBT ceramic packages were exhibited. The following image shows the Hunan Provincial Governor visiting the company's booth.

Wuxi Tianyang Electronics

Drafting meeting for the group standard of AMB aluminum nitride ceramic copper-clad substrate for insulated gate bipolar transistor (IGBT) modules

Wuxi Tianyang Electronics Co., Ltd. & Nanjing University of Technology • School of Materials Special Recruitment Session

Drafting meeting for the group standard of AMB aluminum nitride ceramic copper-clad substrate for insulated gate bipolar transistor (IGBT) modules

Wuxi Tianyang Electronics Co., Ltd. & Nanjing University of Technology • School of Materials Special Recruitment Session

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