1. Difference between ceramic substrates and ceramic substrates

Ceramic substrates are sheet-like materials that use electronic ceramics as a base to form a supporting base for film circuit components and externally mounted components. Ceramic substrates refer to a special process board where copper foil is directly bonded to the surface (single-sided or double-sided) of a ceramic substrate at high temperatures. The ultra-thin composite substrates made of ceramic substrates have excellent electrical insulation performance, high thermal conductivity, excellent soft soldering properties, and high adhesion strength. They can also be etched into various patterns like PCBs and have a large current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. In short, simply put, the substrate has no lines, and the substrate has already etched metal lines.

2. Core Advantages of Ceramic Substrates

Ceramic substrates have high mechanical stress resistance and shape stability; high strength, high thermal conductivity, and high insulation; strong bonding, corrosion resistance; excellent thermal cycling performance, up to 50,000 cycles, high reliability; like PCBs (or IMS substrates), various patterns can be etched; pollution-free and harmless. Performance requirements of ceramic substrates:

1. Mechanical Properties

Sufficiently high mechanical strength, in addition to mounting components, it can also be used as a support component; good machinability, high dimensional accuracy;

2. Electrical Properties

High insulation resistance and insulation breakdown voltage; low dielectric constant; low dielectric loss; stable performance under high temperature and high humidity conditions to ensure reliability.

3. Thermal Properties

High thermal conductivity; thermal expansion coefficient matches related materials (especially the thermal expansion coefficient with Si); excellent heat resistance.

4. Other Properties

Good chemical stability; easy to metallize, strong adhesion between circuit patterns and it; no hygroscopicity; oil-resistant, chemical-resistant; low α-ray emission; the materials used are harmless and non-toxic; the crystal structure does not change within the operating temperature range

Ceramic substrates are also called ceramic circuit boards, ceramic circuit boards, ceramic PCBs, etc. Depending on the ceramic substrate material, ceramic substrates can be divided into alumina ceramic substrates, aluminum nitride ceramic substrates, silicon nitride ceramic substrates, silicon carbide ceramic substrates, etc. According to different processes, they can be divided into DPC ceramic substrates, DBC ceramic substrates, AMB ceramic substrates, HTCC ceramic substrates, LTCC ceramic substrates, etc.; according to the number of layers, they can be divided into single-sided, double-sided ceramic substrates, and multilayer ceramic substrates. Ceramic substrates have good comprehensive electrical performance, and ceramic substrates are more used as substrates for supporting, heat dissipation, and insulation.