Aluminum nitride ceramic copper clad laminate
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  • Aluminum nitride ceramic copper clad laminate

Aluminum nitride ceramic copper clad laminate

  • Commodity name: Aluminum nitride ceramic copper clad laminate
  • Description
  •   Technical Parameters

     

    Project

    Performance Parameters

    Unit

    Whiteboard

    Maximum External Dimensions

    190×138

    mm

    Coefficient of Thermal Expansion

    4.5

    10 -6 /K

    Flexural Strength

    400

    MPa

    Thickness

    0.38/0.635/1.0

    mm

    Circuit Pattern

    Conductor Tolerance

    ±0.3

    mm

    Minimum Conductor Width

    0.7

    mm

    Minimum Conductor Spacing

    0.7

    mm

    AlN Ceramic Copper-clad Laminate

    Thermal Conductivity

    180

    W/m•K

    Copper Thickness

    ≤0.8

    mm

    Surface Roughness

    Ra≤0.8

    um

    Warping

    ≤0.05

    mm/25mm

    Dielectric Constant (1MHz)

    8.5

     

    Dielectric Loss (1MHz)

    9

    10-4

    Soldering Wettability

    >95

    %

    Peel Strength

    ≥150

    N/cm

    Breakdown (Insulation) Strength

    >20

    kV/mm

    Insulation Resistance

    >1014

    Ω·cm

    Wire Bonding Strength

    ≥4.9

    N

    Moisture Resistance

    No change in electrical performance after 500 hours at 85℃ and 85%RH.

     

    High and Low Temperature Shock

    150℃/-45℃, each high and low temperature cycle is maintained for 0.5 h, and the conversion time is 15 s. After 500 cycles, there is no degradation of insulation characteristics.

     

     

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