Aluminum nitride ceramic copper clad laminate
- Commodity name： Aluminum nitride ceramic copper clad laminate
- Description
-
Technical Parameters
Project
Performance Parameters
Unit
Whiteboard
Maximum Dimensions
190×138
mm
Coefficient of Thermal Expansion
4.5
10 -6 /K
Flexural Strength
400
MPa
Thickness
0.38/0.635/1.0
mm
Circuit Pattern
Conductor Tolerance
±0.3
mm
Minimum Conductor Width
0.7
mm
Minimum Conductor Spacing
0.7
mm
AlN Ceramic Copper-Clad Laminate
Thermal Conductivity
180
W/m•K
Copper Thickness
≤0.8
mm
Surface Roughness
Ra≤0.8
um
Warping
≤0.05
mm/25mm
Dielectric Constant (1MHz)
8.5
Dielectric Loss (1MHz)
9
10-4
Soldering Wettability
＞95
%
Peel Strength
≥150
N/cm
Breakdown (Insulation) Strength
＞20
kV/mm
Insulation Resistance
＞1014
Ω·cm
Wire Bonding Strength
≥4.9
N
Moisture Resistance
No change in electrical performance after 500 hours at 85℃ and 85%RH.
High and Low Temperature Shock
150℃/-45℃, each high and low temperature cycle is maintained for 0.5 h, and the conversion time is 15 s. After 500 cycles, there is no degradation of insulation characteristics.
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