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超薄型陶瓷管壳

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超薄型陶瓷管壳系列

  特别说明:Hmin=8mm

  技术参数
  封接气密性:≤1×10-9 Pam3/s
  铜块平面度:≤0.005mm
  铜块平行度:≤0.03mm
  法兰和铜块同心度:≤0.5mm
  封接强度:≥5KN/cm2
  高低温循环:-65℃~200℃ 5次循环
  镀镍厚度:2-7μ

  主要材料:
  陶瓷件:93.5%min AL2O3
  釉水:白色 ,T≥1450℃
  法兰:TU1(OFHC•Cu)or Ni42Fe58 Alloy

  氧化铝外壳、晶闸管、可控硅、电力电子、陶瓷管壳、小天鹅陶瓷、无锡天杨电子、IGBT、电子元器件

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